표제지
목차
국문요약 12
제1장 서론 14
제1절 연구배경 14
제2절 연구목적 및 범위 15
제2장 이론적 배경 17
제1절 최근 패키지 재료의 동향 17
제2절 저유전율 저온소성 다충 배선 기판 20
1) 유리와 세라믹스의 혼합에 의해 제조된 기판 21
2) 결정화 유리로 구성된 기판 21
3) 반응에 의해 생성된 결정상으로 이루어진 기판 21
제3절 저온소성 기판의 소결거동 23
제4절 금속, 세라믹스 접합기구 28
제3장 저온소성 기판의 소결거동 및 결정화 방지기구 33
제1절 서론 33
제2절 실험방법 33
2.1. 유리분말의 제조 35
2.2. 유리의 물성분석 35
2.3. 성형체 제조 37
2.4. 열처리 37
2.5. 측정 및 분석 37
제3절 결과 및 고찰 39
3.1. 소결거동 42
3.2. 물성의 변화 53
3.3. 결정화 방지기구 59
제4절 결론 68
제4장 저온소성 기판과 Cu와의 접합거동 70
제1절 서론 70
제2절 실험방법 71
2.1. 저온소성 기판의 제조 73
2.2. 금속 페이스트의 제조 75
2.3. 프릿트 제조 77
2.4. 스크린 프린팅 77
2.5. 열처리 77
2.6. 측정 및 분석 78
제3절 결과 및 고찰 82
3.1. 열처리 분위기 변화에 따른 CuO 첨가효과 82
3.2. 프릿트 첨가에 의한 접합거동 94
제4절 결론 110
제5장 종합결론 111
References 113
Abstract 122
Table 2-1. Recent High-Performance Ceramic Substrate. 19
Table 2-2. Properties of Several Metals used in Ceramic Package. 19
Table 2-3. Properties of Several Ceramic Fillers and Glasses used in Low-Firing Substrate. 22
Table 3-1. Composition of Borosilicate Glass. 36
Table 3-2. Properties of Borosilicate Glass. 43
Table 3-3. Properties of Low-Firing Substrate (filler content ; 35 vol%, filler size ; 4.0μm,... 54
Table 4-1. Organic Materials used in Tape Casting Slip. 74
Table 4-2. Frit Composites. 97
Table 4-3. Properties of Frits. 97
Table 4-4. Viscosity Control of Metal Paste Contained the Frit by adding the Binder and Solvent. 98
Fig. 2-1. Variation of main sintering mechanism during liquid phase sintering shown as functions of the liquid content. 24
Fig. 2-2. Main bonding mechanisms in the thick film technology. 29
Fig. 2-3. Twin capillary model. 31
Fig. 3-1. Flow chart of experimental procedure. 34
Fig. 3-2. Particle size distribution and morphology of borosilicate glass powders 40
Fig. 3-3. Particle size distribution and morphology of alumina powders 41
Fig. 3-4. Shrinkage behaviors of alumina filled borosilicate glass with sintering temperatures 44
Fig. 3-5. Sintering behavior model at the alumina filled borosilicate glass system. 47
Fig. 3-6. Microstructural changes of alumina filled borosilicate glass with sintering temperatures (filler size ; 4.0μm,... 50
Fig. 3-7. Microstructural changes of alumina filled borosilicate glass with sintering temperatures (filler size ; 0.4μm,... 51
Fig. 3-8. Microstructural changes of alumina filled borosilicate glass at 900℃ for 10min (filler size ; 4.0μm, filler content ; 35vol%) 52
Fig. 3-9. Changes of bending strength of 35 vol% alumina filled borosilicate glass with temperatures and filler sizes... 55
Fig. 3-10. Density variation of 35 vol% alumina filled borosilicate glass with temperatures and filler sizes as indicated. 57
Fig. 3-11. X-ray diffraction patterns of alumina filled borosilicate glass at 900℃ for 10min 60
Fig. 3-12. X-ray diffraction patterns of borosilicate glass at distance about (a) 2mm and (b) 30μm from the interface of alumina substrate. 62
Fig. 3-13. SEM photographs of borosilicate glass 63
Fig. 3-14. EDAX spectrum of crystal phase in Fig. 3-13 (a). 64
Fig. 3-15. Microprobe analysis at the interface between glass and alumina substrate and Raman spectrum of (a) borosilicate... 65
Fig. 3-16. Results of water-erosion test. 67
Fig. 4-1. Co-firing flow chart of low-firing substrate and Cu conductor. 72
Fig. 4-2. Doctor-blade tape caster and green sheets by tape casting 76
Fig. 4-3. Sample used in bond strength test. 79
Fig. 4-4. Measurement method of normalized camber. 81
Fig. 4-5. Thermal analysis of binder, plasticizer and copper. 83
Fig. 4-6. Sheet resistance of Cu as the functions of reducing temperatures and holding times. 85
Fig. 4-7. Sheet resistance of Cu as the functions of binder-burnout and reducing temperatures. 86
Fig. 4-8. Camber data as a function of Cu and CuO mixing ratio. 87
Fig. 4-9. Bond strength and sheet resistance as a function of Cu/CuO ratio. 89
Fig. 4-10. SEM photograph and microprobe analysis of metal-ceramic interface (Cu:CuO=40:60 wt%). 90
Fig. 4-11. X-ray diffraction patterens of mixture compound of Cu, CuO and substrate composition 92
Fig. 4-12. SEM photographs of Cu and CuO powders 93
Fig. 4-13. Sheet resistance and bond strength as a function of frit content. 99
Fig. 4-14. Surface XRD diffraction patterns of test pad areas on low-firing substrate after bond strength test 101
Fig. 4-15. Photographs and dot maps of test pad areas on low-firing substrate after bond strength test 102
Fig. 4-16. SEM Photograph of metal-ceramic interface (Cu:CuO=40:60 wt% with 3wt% A frit). 104
Fig. 4-17. Dot maps of test pad areas on low-firing substrate after bond strength test 106
Fig. 4-18. Bond strength and sheet resistance of conventional and new co-firing process 107
Fig. 4-19. SEM photograph and microprobe analysis of metal-ceramic interface by conventional co-firing process. 109