The aim of this work was to investigate the effects of electrodeposition conditions on the microstructuralcharacteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent onelectrodeposition conditions such as system current and current density, as well as the bath solution itself. The current densitysignificantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had verysignificant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization athigh current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220)preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased withincreasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. Thesheet resistance increased with increasing current density in the DC system due to the decreased grain size.