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Title Page
Contents
Abstract 10
1. Introduction 11
2. Backgrounds 12
2.1. Electromagnetic interference shielding (EMS) 12
2.1.1. Electromagnetic interference (EMI) 12
2.1.2. Electromagnetic compatibility (EMC) 12
2.1.3. Electromagnetic interference shielding (EMS) 13
2.1.4. Basic theory in EMS 13
2.1.5. SE test method 16
2.2. Metal Films in EMS 17
2.3. Metal Powders in EMS 24
2.3.1. Powder size and shape influence 24
2.3.2. Metal powders in EMS 26
2.4. Silver-coated-copper dendritic powders 31
2.4.1. Properties 31
2.4.2. Coating methods 35
3. Experiments 42
4. Results and discussion 44
4.1. Copper dendrites morphology under different parameters 44
4.1.1. Cl- concentration 44
4.1.2. p H 46
4.1.3. The reaction with CTAB 47
4.1.4. The reaction with H Ac 48
4.2. Silver coating process 49
Conclusions 55
References 56
논문요약 59
Table2.1. Relative Conductivity and Permeability of Materials at 1 KHz 18
Table2.2. Skin depth of copper under 1 ~ 10GHz 20
Table2.3. SE (dB) by Experiments and Simulation 21
Table2.4. SE (dB) at 900 MHz with each layer of 100 nm 21
Table2.5. Comparison between the shielding effectiveness of copper and aluminum 22
Table2.6. Experimental and theoretical values of the effective thermal conductivity of copper powder 24
Table2.7. EMI shielding effectiveness (dB) of nickel- and silver-powder-filled SIM-2030M composite materials[23] 28
Table2.8. EMI shielding effectiveness (dB) of nickel-fiber-filled SIM-2030M composite materials[23] 28
Table2.9. Comparison of CA Values of the Ag Film Surfaces before and after the Surface Modification with n-Dodecanethiol[9] 36
Table2.10. Composition of the electroless plating bath and operating parameters[6] 37
Fig2.1. Electromagnetic radiation vector 14
Fig2.2. Attenuation of an electromagnetic wave by a shield [10] 15
Fig2.3. Image of coaxial transmission line[10] 16
Fig2.4. (a) The absorption and (b) reflection for plane wave at 300 M Hz [1] 19
Fig2.5. Comparison of various EMI coating technologies (Evaluation of shielding effectiveness: Very good to excellent:〉= 80 dB; Good to very good: 60 ~ 80 dB; Fair to good: 20 ~ 60 dB; Unsatisfactory: 〈20 dB) [14] 23
Fig2.6. Aluminum coatings shielding efficiency in different thickness[14] 23
Fig2.7. Copper conductivity with different shape 25
Fig2.8. (a) Particle size influence (b) Resistivity influence to the effective real permeability versus frequency 25
Fig2.9. Effect of acid etching temperature on the EMI shielding effectiveness: unetched (◆); 25℃ (■); 40℃ (●); 60℃ (▲) 26
Fig2.10. SEM micrographs of the Cu coated PET fabrics which were etched at temperatures: (a) unetched; (b) 25 ℃; (c) 40 ℃; (d) 60 ℃ 27
Fig2.11. SEM image and reflection loss in different thickness of porous Fe₃O₄/carbon core/shell nanorods 29
Fig2.12. SEM, RL and fabrication process of hierarchical dendrite-like Fe₃O₄, γ-Fe₂O₃, and Fe 31
Fig2.13. Dependence of sheet resistance of metal films prepared from 5, 10, 15, and 20 wt. % Silver-coated copper powder on oxidation time (the oxidation time is the time when metal films were exposed in air at 150 ℃) 32
Fig2.14. Changes of color of copper particles coated silver with various loading as a function of oxidation temperature. The samples were oxidized under atmospheric condition 33
Fig2.15. (a) The silver crystallite size (open circles) and the copper oxides (CuO and Cu2O) percentage in heated patterns (filled circles) as a function of temperature. (b) The resistivity calculated for printed patterns (on glass) heated under N2 as a function of temperature 34
Fig2.16. Surface morphologies of as-deposited Ag films on Cu alloys from 0.01 M AgCl DES solution at RT, where the insets are the corresponding high resolution images. The deposition time is (a) 1, (b) 5, and (c) 10 min. (d) The EDS mapping analysis corresponding to c. The peaks of Cu and Fe in Figure 1d are from the Cu alloy substrate 36
Fig2.17. Cross-section micrographs of silver-coated copper powder with (a) 5, (b) 10, (c) 15, and (d) 20 wt.% silver contents 37
Fig2.18. Effect of NH₄OH/(NH₄)₂SO₄ molar ratio on the characteristics of composite powders 38
Fig2.19. Effect of activation time on the characteristics of composite powders 38
Fig2.20. Characteristics of composite powder along with plating time 39
Fig2.21. (a) TEM, (b) HRTEM images of 20 wt.% silver coated copper, and (c) element profile across the particle diameter direction. The sample was exposed to air for 1 month 40
Fig2.22. (a) Correlation between copper/silver cell potential and Ag nanostructures in different electrolyte (b) and (c) uniform Ag nanoshell formation on the copper microparticle (commercially available) and copper nanowire (template synthesized) 41
Fig2.23. Ag nanostructures formed as a function of copper particle size at 5mM AgNO₃ solution for 5 min\ 41
Fig3.1. The illustration of the experiment process 43
Fig4.1. Cl- concentration: 0.1M CuCl₂ with (a,b)1, (c,d)0.1, (e,f)0.01, (g) 0M NaCl and (h)0.01M CuCl₂ with 0M NaCl 45
Fig4.2. Some chloride complexes of copper 45
Fig4.3. Different pH at 0(a), 1(b), 2(c), 3(d), 5(e) and 7(f) adjusted by HCl in 0.1 M CuCl₂ solution with NaCl balancing the Cl- concentration to 1.1 M 46
Fig4.4. (a), (b), (c) of 0.1M and (d),(e), (f) of 0.01M CTAB with 0.1M CuCl₂ reaction for 1h 47
Fig4.5. 0.1 M CuCl₂ with 0.1 M H Ac (a, b), 0.3 M H Ac (c, d) and 1 M H Ac (e, f) 48
Fig4.6. (a), (b)copper dendrites in 0.1M CuCl₂, 0.1M H Ac solution; (c), (d) after silver coating with silver atom percent 2.94% detected by EDX. 50
Fig4.7. a is copper dendrites obtained in 0.1M CuCl₂ and 0.3M HCl; b, c, d are three different methods of silver coating at silver percent designed at 10%. 50
Fig4.8. XRD pattern of silver-coated-copper dendritic powders from AgNO₃ 52
Fig4.9. SE data of silver-coated-copper dendritic powders from AgNO₃; 1, 2, 3 are 10%, 30%, 50% silver atom percent sample respectively; 4 and 5 are two commercial silver-coated-copper dendritic powders. 53
Fig4.10. SEM images of (a) copper dendrites from 0.01M CuCl₂ and 0.5M H₂SO₄; (b), (c) and (d) are 10%, 30% and 50% silver atom percent silver-copper dendrites respectively fabricated from AgNO₃ and Na₂S₂O₃. 54
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