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국내공공정책정보
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논문명/저자명
Preparation and evaluation of eco-friendly wood-based panel used on building materials to reduce formaldehyde emission rate = 포름알데히드 방출 저감을 위한 건축내장재용 친환경 목질판상재의 제조 및 평가 / Junhyun Kim 인기도
발행사항
서울 : 숭실대학교 대학원, 2013.2
청구기호
TM 720 -13-35
형태사항
xii, 68 p. ; 26 cm
자료실
전자자료
제어번호
KDMT1201334620
주기사항
학위논문(석사) -- 숭실대학교 대학원, Dept. of Architecture, 2013.2. 지도교수: Sumin Kim
원문

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Title Page

Contents

ABSTRACT 10

국문초록 12

CHAPTER 1. Introduction 15

CHAPTER 2. Literature study on pollutant low-emission materials 19

2.1. Definition and impact of formaldehyde 19

2.2. Addition of natural substances 22

2.3. Addition of metallic materials 25

CHAPTER 3. Different synthesis methods of phenol-urea-formaldehyde resin 27

3.1. Experiment 27

3.1.1. Preparation of PUF resin 27

3.1.2. Preparation of wood-based composite 29

3.2. Characterization techniques 30

3.2.1. Differential scanning calorimetry (DSC) 30

3.2.2. Thermogravimetric Analysis (TGA) 30

3.2.3. Fourier transform infrared spectroscopy (FT-IR) 30

3.2.4. Desiccator method 30

3.2.5. Field and Laboratory Emission Cell (FLEC) Method 31

3.2.6. Universal testing machine (UTM) 32

3.3. Results and discussion 32

3.3.1. Characterization of prepared resins 32

3.3.2. Formaldehyde emission rate 37

3.3.3. Mechanical properties 40

CHAPTER 4. Tannin resin as novel environment-friendly adhesion system 43

4.1. Experiment 43

4.1.1. Materials 43

4.1.2. Preparation of adhesion systems 43

4.2. Characterization techniques 45

4.2.1. Perforator method 45

4.3. Results and discussion 46

4.3.1. Formaldehyde content 46

4.3.2. Formaldehyde emission rate 48

4.3.3. Mechanical properties 49

CHAPTER 5. xGnP as a porous carbon nano materials 52

5.1. Experiment 52

5.1.1. Materials 52

5.1.2. Preparation of wood-based composite 53

5.2. Characterization techniques 54

5.2.1. Thermal conductivity 54

5.3. Results and discussion 55

5.3.1. Pollutants emission rate 55

5.3.2. Physical properties 57

5.3.3. Thermal conductivity 58

CHAPTER 6. Conclusion 59

REFERENCES 62

[Table 3-1] Synthetic methods of resin applied to the surface layer 28

[Table 3-2] Pressing conditions of particle boards 29

[Table 3-3] Curing characteristics of prepared resins by using a DSC 32

[Table 4-1] Preparation of resins and manufacturing conditions of wood-based panel 44

[Table 5-1] Physical properties of HDF according to the amount of xGnP (wt%) added 57

[Figure 2-1] Application plan of source control method on a wood-based panel 21

[Figure 2-2] Chemical structure of some phenols synthesized from HT 23

[Figure 2-3] Chemical structure of wattle tannin (Acacia mearnsil) 24

[Figure 2-4] Conceptual illustration of water vapor effect on contaminant adsorption / absorption in porous media 25

[Figure 3-1] Schematic design of fabricated board 29

[Figure 3-2] TG and DTG curves for prepared resins 35

[Figure 3-3] FT-IR spectra of prepared resins by synthesis 36

[Figure 3-4] Formaldehyde emission rates of particle boards with various resins for surface layer using desiccator method 38

[Figure 3-5] Comparison of formaldehyde emission rates of particle boards between desiccator method and FLEC 39

[Figure 3-6] Mechanical properties of particle boards with various resins for surface layer using a universal testing machine 41

[Figure 4-1] Formaldehyde content from particle boards by perforator method 47

[Figure 4-2] Formaldehyde emission from particle board by desiccator method 48

[Figure 4-3] Mechanical properties of particle board with various adhesion systems by using a universal testing machine 50

[Figure 5-1] Acid intercalation and Exfoliation 52

[Figure 5-2] Prepared board according to xGnP content 53

[Figure 5-3] Tci Thermal conductivity analyzer 54

[Figure 5-4] VOC concentration according to the amount of xGnP (wt%) added 56

[Figure 5-5] HCHO concentration according to the amount of xGnP (wt%) added 56

[Figure 5-6] Thermal conductivity according to the amount of xGnP (wt%) added 58

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