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Title Page
ABSTRACT
국문요약
Contents
I. INTRODUCTION 9
1.1. Background 9
1.2. Motivation 10
II. MATERIALS AND METHODS 11
2.1. Preparation 11
2.1.1. Preparation of a stamp 11
2.1.2. Fabrication of ultrathin micro semiconductor plates 11
2.2. Transfer-printing process 12
2.2.1. Automatic transfer-printing 14
III. RESULTS AND DISCUSSIONS 15
3.1. Competing adhesion 15
3.2. Roll adhesion test 16
3.2.1. Roll adhesion test background 16
3.2.2. Adhesion measurement 18
3.3. Pressure distribution 20
3.3.1. Pressure measurement 20
3.3.2. Effect of distributed pressure 22
IV. DEMONSTRATIONS 23
4.1. Transfer-printed ultrathin micro semiconductor plates 23
V. CONCLUSION 25
VI. SUMMARY 26
References 28
Curriculum Vitae 33
Education 33
Figure 1. Schematic illustrations of a series of fabrication process for micro scale Si plates. 11
Figure 2. Schematic illustrations and images of adhesiveless transfer-printing procedure by bending an... 12
Figure 3. Image of multi-axis transfer printing system consisting of a vacuum chuck, a motorized stage that... 14
Figure 4. Schematic cross-section view of the being printed micro Si plate. Rate-dependent energy release... 15
Figure 5. Schematic illustrations of relation between the bending radius of the stamp and the adhesion energy. 16
Figure 6. Energy release rate as a function of quantified rolling speed and the radius of glass rods. Black, red,... 18
Figure 7. (a) Micro scale Si plates that are being printed on the target substrate. The printing process was... 19
Figure 8. A set of pressure measurement system. 20
Figure 9. (a), (b) Pressure distribution applied on the Si plates or the substrate by deforming the stamp. Each... 21
Figure 10. Measured distances of transfer printed neighboring micro scale Si plates as the stamp thickness... 22
Figure 11. Optical images of transfer printed micro Si plates on glass substrates. 22
Figure 12. (a), (b) Images of transfer printed square and rectangular micro scale Si plates that have various... 23
Figure 13. (a) Optical image of transferred micro Si plate array on the glass substrate at 25 mm/s in peeling... 24
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