1 |
C. S. Ryu, "Embedded PCB Technology and Market Trend", KPCA Show International Symposium Proceeding, pp. 107-116, 2005. |
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2 |
Peter A. Sandborn, "A Review of the Economics of Embedded Passives", Proceedings of InterPACK03: International Electronic Packaging Technical Conference, pp.123-129, 2003 |
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3 |
전자부품연구원 기술정책실, "EPC(Embedded passive Components) PCB", 전자부품연구원 전자정보센터(www.eic.re.kr), 2008 |
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4 |
W. Yu, B. Sc., "Optimization of Spiral Inductors and LC Resonators Exploiting Space Mapping Technology", Thesis Degree Master of Applied Science, Department of Electrical and Computer Engineering, McMaster Univ., 2006. |
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5 |
R. Ulrich, "Integrated Passive component technology", IEEE Press, pp.55∼74, 2003. |
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6 |
Manoj kumr Damani, "Physics Based Reliability Assessment of Embedded Passives", Master Thesis, Georgia Institute of Technology, 2004. |
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7 |
S. R. Kythakyapuzha, "Modeling of Spiral Inductors and Transformers", Thesis degree of Master of Science, Department of Electrical Engineering and Computer Engineering, Kansas State Univ., 2004. |
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8 |
Characteristic Variation of 3-D Solenoid Embedded Inductors for Wireless Communication Systems
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9 |
Fully embedded high Q circular stacked spiral inductors into organic substrate  |
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10 |
High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications  |
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