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국회도서관 홈으로 정보검색 소장정보 검색

초록보기

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

권호기사

권호기사 목록 테이블로 기사명, 저자명, 페이지, 원문, 기사목차 순으로 되어있습니다.
기사명 저자명 페이지 원문 목차
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Cyclone separator의 형상에 따른 미세플라스틱 입자 거동 수치해석 연구 = Numerical analysis study on micro-plastic particle behavior according to the shape of cyclone separator 강인선, 서원준, 유동호, 김영식, 김형철, 임석연 p. 61-66

CMP 패드 컨디셔닝에서 딥러닝을 활용한 컨디셔너 스윙에 따른 패드 마모 프로파일에 관한 연구 = Study on the pad wear profile based on the conditioner swing using deep learning for CMP pad conditioning 박병훈, 황해성, 이현섭 p. 67-70