감사의 글
Nomenclature
국문요약
목차
1. 서론 14
1.1 연구 배경 14
1.2 연구 목표 16
2 . 이론 17
2.1. Soldering 과 Flux 17
2.1.1 Soldering의 정의 17
2.1.2 Flux의 정의 17
2.1.3 Soldering의 기본요소 18
2.1.4 예열의 목적 18
2.1.5 Soldering 평가 방법 19
2.1.6 재료 20
2.1.6.1 Solder 20
2.1.6.2 Flux 23
2.1.6.3 Auto-Solder Machine 23
2.1.7 Flux의 역할과 Soldering 모형도 28
2.1.8. Solder의 Wetting 과정 30
2.2 실험 방법 32
2.2.1 퍼짐율 실험 34
2.2.2 부식성 실험 36
2.2.3 절연저항 실험 36
2.2.4 미납수 실험 38
2.2.5 PCB청결도 38
3. 결과 및 고찰 38
3.1. Lab Test 결과 38
3.2 현장적용 실험결과 44
3.3 각 사의 제품별 Flux 특성비교 평가 49
3.3.1 예열온도에 대한 cold solder비교 49
3.3.2 예열온도에 대한 solder ball 비교 49
3.3.3 예열온도에 대한 short 비교 49
4. 결론 52
5. 참고문헌 55
Abstract 55
Table 1. Assembly process 24
Table 2. The mixing ratio for manufacturing flux 32
Table 3. Test result 39
Figure 1. Ideally wet state 19
Figure 2. Wet state 19
Figure 3. Not wet state 20
Figure 4. Dry state 20
Figure 5. The ratio of the solder alloy 22
Figure 6. Auto solder machine 25
Figure 7 The wetting process of solder 31
Figure 8. Spreading test result 40
Figure 9. Corrosive test specimen 41
Figure 10. SIR specimen 42
Figure 11. PCB cleaning result 43
Figure 12. The occurrence rate of cold solder by temperature 46
Figure 13. The occurrence rate of short by temperature 46
Figure 14. The occurrence rate of solder ball by temperature 47
Figure 15. The changing rate of three parameters by variations of pre-heating temperature 47
Figure 16. Set-top-box PCB 48
Figure 17. The comparison of the occurrence of cold solder among each company 50
Figure 18. The comparison of the occurrence of solder ball among each company 50
Figure 19. The comparison of the occurrence of short among each company 51