표제지
목차
ABSTRACT 10
I. 서론 12
1.1. 연구 배경 12
1.2. 연구 목적 및 범위 15
II. 복합재 접착 체결부의 강도 시험 16
2.1. 시편 제작 16
2.2. 성형 사이클 19
2.2.1. 제작 공정 21
2.2.2. 성형 방법 24
2.3. 환경 조건 26
III. 고온흡습(ETW) 시험결과 및 검토 28
3.1. 접착 체결부 고온흡습 시험 28
3.2. 수분율에 따른 접착 체결부 파손하중 및 강도 32
3.2.1. 상온에서 수분율에 따른 접착 체결부 파손하중 및 강도 37
3.2.2. 고온에서 수분율에 따른 접착 체결부 파손하중 및 강도 51
IV. 환경노출효과 및 검토 63
V. 결론 65
참고문헌 67
감사의 글 70
Table 1. Test Matrix 18
Table 2. Property of AGATE data sheet 34
Table 3. Property of Toray data sheet in room temperature condition 34
Table 4. Test Result in Lab 35
Table 5. Comparison of properties 35
Table 6. Strength and Displacement under different test temperature 64
Fig. 1. B787 Materials 14
Fig. 2. A350 XWB Material Breakdown 14
Fig. 3. Configuration of bonded single-lap joint specimen 16
Fig. 4. Curing cycle of Toray T700GC-12K-31E/#2510. 19
Fig. 5. Curing cycle of EA9696 film adhesive. 20
Fig. 6. Fabrication process of test specimens 23
Fig. 7. Curing method for laminate. 25
Fig. 8. Curing method for secondary bonding. 25
Fig. 9. Traveler specimens 29
Fig. 10. Environmental water bath 30
Fig. 11. Moisture contents graph of traveler specimens 31
Fig. 12. Moisture contents graph of adhesive traveler specimens 31
Fig. 13. Testing for room temperature environment 33
Fig. 14. Testing for elevated temperature environment 33
Fig. 15. Failure load and displacement of joint with 0.0% moisture content under room temperature 38
Fig. 16. Failure mode of joint with 0.0% moisture content under room 39
Fig. 17. Failure load and displacement of joint with 0.2% moisture content under room temperature 40
Fig. 18. Failure mode of joint with 0.2% moisture content under room 41
Fig. 19. Failure load and displacement of joint with 0.5% moisture content under room temperature 43
Fig. 20. Failure mode of joint with 0.5% moisture content under room temperature 44
Fig. 21. Failure load and displacement of joint with 1.0% moisture content under room temperature 45
Fig. 22. Failure mode of joint with 1.0% moisture content under room 46
Fig. 23. Failure load and displacement of joint with saturated moisture content under room temperature 48
Fig. 24. Failure mode of joint with saturated moisture content under room temperature 49
Fig. 25. Failure load and strength of joint with different moisture content under room temperature condition 50
Fig. 26. Graph of failure load and displacement - joint specimens with 0.0% moisture content under hot(71℃) temperature 52
Fig. 27. Failure mode of joint with 0.0% moisture content under hot temperature 53
Fig. 28. Graph of failure load and displacement - joint specimens with 0.2% moisture content under hot(71℃) temperature 54
Fig. 29. Failure mode of joint with 0.2% moisture content under hot temperature 55
Fig. 30. Graph of failure load and displacement - joint specimens with 0.5% moisture content under hot(71℃) temperature 56
Fig. 31. Failure mode of joint with 0.5% moisture content under hot temperature 57
Fig. 32. Graph of failure load and displacement - joint specimens with 1.0% moisture content under hot(71℃) temperature 58
Fig. 33. Failure mode of joint with 1.0% moisture content under hot temperature 59
Fig. 34. Graph of failure load and displacement - joint specimens with saturated moisture content under hot(71℃) temperature 60
Fig. 35. Failure mode of joint with saturated moisture content under hot temperature 61
Fig. 36. Failure load and strength of joint with different moisture content under hot(71℃) temperature condition 62