Polishing is not only one of the most frequently adopted processes in modern manufacturing industries such as semi conductor wafer, LED sapphire wafer and LCD panel. but also the most critical to the surface quality of the products. In most cases, the surface defects are originated from the structural vibrations of the polishing machine.
In this paper, the dynamic characteristics of a wafer polishing machine have been analyzed through the frequency response test and the computer simulation. And the design parameters affecting the stability of the polishing machine have been investigated to stabilize the machine structure and further to reduce the defects of the polished products.
The result of the study shows that simple design alterations of the supporting area without modifying the main structure of the machine can suppress the vibrations of the machine significantly and the reduced vibration will consequently improve the surface quality of the polished wafers.