Contents
Development of semiconductor packaging technology using dicing die attach film / Keunhoi Kim ; Kyoung Min Kim ; Tae Hyun Kim ; Yeeun Na 1
Abstract 1
1. INTRODUCTION 1
2. EXPERIMENTAL 1
2.1. Wafer and DDAF Preparation 1
2.2. Tape Laminate Process 2
2.3. Dicing Process 2
2.4. Die Bonding Process 2
3. RESULTS AND DISCUSSIONS 3
4. CONCLUSIONS 5
REFERENCES 5