목차
1. 서론 1
2. 본론 2
2.1. 기계적 힘의 인가에 의한 소재 동적거동의 정성적 분석 2
2.2. 기계적 힘의 인가에 의한 소재 동적거동의 정량적 분석 3
2.3. 다른 연구 분야 5
3. 결론 6
참고문헌 6
Fig. 1. In-situ straining TEM holder. 1
Fig. 2. Schematic illustrations of ways in which an advancing crack interacts with microstructure. 2
Fig. 3. Bright field TEM images of dislocation movement observed in Ni. 2
Fig. 4. Crack formation and propagation behavior in nanocrystalline Ni thin film. 2
Fig. 5. Crack interaction with a high angle grain boundary in a coarse grained Cu thin film. 3
Fig. 6. Nano indentation holder and PTP (push-to-pull) device from Hysitron. 4
Fig. 7. Single crystal Cu sample with D ~ 166nm under tensile loading. 4
Fig. 8. TEM images from in situ tensile tests of [0001] oriented Mg. 4
Fig. 9. Dislocation emission by the operation of single-ended spiral sources. 5
Fig. 10. (A to C) Stress-strain curves for deformation recovery experiments on specimen A (aluminum). A fraction of the plastic strain is recoverable, and, once that strain is recovered, the specimen shows no residual hardening during the next loading. 5
Fig. 11. In-situ bending experiment conducted in the LBNL HVEM showing CNT kinking. 5
Fig. 12. IDomain structure in PMN-PT (a) before and (b) after biasing. DF TEM images under g¼002 (top) and g¼11 1 (middle) conditions and corresponding schematics of nanodomain structures(bottom). 6