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표제지
감사의 글
목차
국문요약 15
제1장 서론 18
제2장 이론적 배경 20
2.1. 소자의 스케일링(스케일일) (Scaling(Sacling)) 20
2.1.1. MOSFET의 스케일링 20
2.1.2. 실리콘산화막의 스케일링 30
2.2. 고유전박막 (high-k) 42
2.2.1. 게이트 유전막재료로서의 고려사항 42
2.2.2. ZrO₂와 HfO₂ 박막의 물리적 성질 61
제3장 ALD 법으로 성장시킨 HfO₂ 및 Hf silicate 박막의 미세구조 및 물리적 특성 71
3.1. 서론 71
3.2. 실험 74
3.2.1. 실험 장치 74
3.2.2. 실험 방법 83
3.3. ALD로 성장시킨 HfO₂와 Hf silicate 박막의 미세 구조 93
3.3.1. Hf 및 Si 전구체의 선택 93
3.3.2. ALD로 성장시킨 HfO₂ 증착 특성 97
3.3.3. ALD로 성장시킨 HfO₂ 박막의 후속 열처리에 따른 물성 변화 110
3.4. ALD로 성장시킨 Hf silicate 박막 특성연구 117
3.4.1. Hf-silicate 박막의 Si조성에 따른 물리적 특성 117
3.4.2. Hf silicate 박막의 Si조성에 따른 전기적 특성 132
3.5. 결론 140
제4장 ALD 법으로 성장시킨 Hf silicate박막의 후속 열처리에 따른 미세구조 및 물리적, 전기적 특성 연구 142
4.1. 서론 142
4.2. 실험방법 145
4.3. 후속 열처리에 따른 Hf silicate 박막의 미세구조 변화 147
4.4. 후속 열처리에 따른 Hf-ailicate 박막의 전기적 특성 변화 157
4.5. 결론 166
참고 문헌 168
ABSTRACT 186
Fig. 2-1. Moore's Law, the doubling of transistors every couple of years, has been maintained, and still holds true today. 25
Fig. 2-2. Cross-sectional view of the basic p-bulk (n-channel) MOSFET structure. 27
Fig. 2-3. Band diagram and FET. 29
Fig. 2-4. Structure of SiO₂ The 6-membered ring structure of SiO₂ is shown conceptually on the right. 34
Fig. 2-5. Model of silicon oxidation. 35
Fig. 2-6. (a) Conceptual atomic level picture of the Si/SiO₂ interface showing possible structural origins of Qf and Qit, and (b) 4 types of charges associated with the SiO₂/Si system.(이미지참조) 40
Fig. 2-7. (a) Gate leakage upon for various oxide thickness and (b) EOT as a function of physical oxide thickness. 41
Fig. 2-8. Band offset calculations for a number of potential high-k gate dielectric materials. 48
Fig. 2-9. Correlation between Eg, k, and leakage current. 49
Fig. 2-10. Ellingham Diagram for formation of metal oxide. 53
Fig. 2-11. Ternary phase diagrams for (a) Ta-Si-O, (b) Ti-Si-O, and (c) Zr-Si-O compounds. 55
Fig. 2-12. Three types of growth modes : (a) Frank-van der Merwe groth mode, (b) Volmer-Weber growth mode, and (c) Stranski-Kratanov growth mode. 66
Fig. 2-13. Leakage current at 1MV/cm and k versus temperature of post-sputtering anneal for Ta205 films. 69
Fig. 2-14. Fluorite structure and its (110) plane. 70
Fig. 3-1. A schematic diagram of the basic principle of the ALD processing. 78
Fig. 3-2. A processing window of the ALD process. 80
Fig. 3-3. Schematic view of (a) vertical furnace and (b) RTP. 81
Fig. 3-4. Rotation type spectroscopic ellipsometer. 88
Fig. 3-5. Schematic flow chart for TEM specimen preparation. 89
Fig. 3-6/3-7. Clausius-Clapeyron plots of Hf[N(CH₃)(C2H5)]₄ (TEMAHf) and Hf[N(C2H5)₂]₄ (TDEAHf). Vapor pressure of Hf[N(CH₃)(C2H5)]₄, and Hf[N(C2H5)₂]₄ are ~0.5Torr, and ~0.1 Torr at the temperature of 85℃, respectively.(이미지참조) 95
Fig. 3-7/3-8. Clausius-Clapeyron plots of SiH[N(CH₃)₂]₃, Si[N(CH₃)₂]₄, and SiH[N(C2H5)₂]₃. Vapor pressure of SiH[N(CH₃)₂]₃ are ~25 Torr at the temperature of 50℃.(이미지참조) 96
Fig. 3-8/3-9. Thickness of HfO₂ films measured by spectroscopic ellipsometer 100
Fig. 3-9/3-10. HR-TEM images of as-deosited. HfO₂ ; (a) 2 nm, (b) 3 nm, (c) 4 nm, (d) 5nm, and (e) 8nm 101
Fig. 3-10/3-11. XPS wide scan spectrum of HfO₂ and SiO₂ film 104
Fig. 3-11/3-12. C-V characterizatics upon film thickness of HfO₂ 107
Fig. 3-12/3-13. EOT of HfO₂ upon the thickness of HfO₂ increased 109
Fig. 3-13/3-14. XRD spectra of as-deposited ~8 nm thick HfO₂ at various annealing temperature 112
Fig. 3-14/3-15. HR-TEM image of ~5 nm thick HfO₂ at various annealing temperature ; (a) as~dep., (b) annealing at 600℃ and (c) at 800℃ 113
Fig. 3-15/3-16. Capacitance-Voltage Curve and C/Co of ~5 nm thick HfO₂at various annealing temperature ; (a) Capacitance-Voltage Curve, and (b) C/Co-Voltage Curve 115
Fig. 3-16/3-17. XPS wide scan spectra of various compositional Hf silicate film 120
Fig. 3-17/3-18. Cycle ratio vs. Composition of various Hf silicate films 121
Fig. 3-18/3-19. (a) Hf 4f and (b) Si 2p photoelectron spectra with various compositional Hf silicate 123
Fig. 3-19/3-20. refractive index and extinction coefficient spectra with various compositional Hf silicate measured by spectroscopic ellipsometer 125
Fig. 3-20/3-21. HR-TEM image of as-depoited HS51 ; (a) 3 nm thick. (b) 4 nm thick. (c) 5 nm thick. and (d) 8 nm thick 127
Fig. 3-21/3-22. HR-TEM image of as-depoited HS31 ; (a) 3 nm thick. (b) 4 nm thick. (c) 5 nm thick. and (d) 8 nm thick 128
Fig. 3-22/3-23. HR-TEM image of as-depoited HS11 ; (a) 3 nm thick. (b) 4 nm thick. (c) 5 nm thick. and (d) 8 nm thick 129
Fig. 3-23/3-24. HR-TEM image of as-depoited HS13 ; (a) 3 nm thick. (b) 4 nm thick. (c) 5 nm thick. and (d) 8 nm thick 130
Fig. 3-24/3-25. HR-TEM image of as-depoited HS15 ; (a) 3 nm thick. (b) 4 nm thick. (c) 5 nm thick. and (d) 8 nm thick 131
Fig. 3-25/3-26. C-V characterizatics upon composition of Hf silicate ; (a) HS51, (b) HS11, and (c) HS15 135
Fig. 3-26/3-27. EOT of various Hf silicates upon the thickness increased 136
Fig. 3-27/3-28. Dielectric constant vs. composition of Hf silicates 137
Fig. 3-28/3-29. Capacitance-voltage curve of ~5 nm thickness Hf silicates 138
Fig. 4-1. Schmatic of passible issues when high k dielectric gats stack used 144
Fig. 4-2. XRD spectra of Hf silicate with annealing temperature ; (a) HfO₂, (b) HS51, (c) HS31, (d) HS11, (e) HS13, and (f) HS15 150
Fig. 4-3. NEXAFS O k edge absorption spectra of Hf silicate with annealing temperature ; (a) HfO₂, (b) HS51, (c) HS31, (d) HS11, (e) HS13, and (f) HS15 151
Fig. 4-4. HR-TEM image of ~5 nm thick HS51 at various annealing temperature ; (a) as-dep., (b) annealing at 700℃, (c) at 800℃ and (d) at 900℃ 152
Fig. 4-5. HR-TEM image of ~5 nm thick HS11 at various annealing temperature ; (a) as-dep., (b) annealing at 600℃, (c) at 800℃ and (d) at 900℃ 153
Fig. 4-6. HR-TEM image of ~5 nm thick HS11 annealed at 900℃ ; (a) High resolution image and (b) low-magnitude image 154
Fig. 4-7. (a) Hf 4f and (b) O 1s photoelectron spectra of HS11 with annealing temperature 155
Fig. 4-8. HR-TEM image of ~5 nm thick HS15 at various annealing temperature ; (a) as-dep., (b) annealing at 700℃, (c) at 800℃ and (d) at 900℃ 156
Fig. 4-9. Capacitance-Voltage Curve of ~5 nm thick HS15 at various annealing temperature 160
Fig. 4-10. Capacitance-Voltage Curve of ~5 nm thick HS11 at various annealing temperature 162
Fig. 4-11. Capacitance-Voltage Curve of ~5 nm thick HS15 at various annealing temperature 164
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