국내기사
저궤도 전자광학위성 탑재 적외선 카메라 신호처리보드의 열설계 및 열적 안정성 평가 = Thermal design and thermal stability evaluation of infrared camera signal process board for LEO electro-optic satellite
This paper presents the thermal design and reliability assessment of an Infrared camera Signal Processing Module (IRSPM) for low Earth orbit (LEO) electro-optic satellites. The IRSPM (352 × 196 × 113.5 mm, 5.13 kg) contains three Signal Processing Boards (SPB), three interface boards, and one power supply board. A geometric model was prepared in HyperMesh and a node based thermal mathematical model was implemented in Thermal Desktop and SINDA/FLUINT. Steady‑state analyses under an acceptance hot case boundary (+40°C base plate) included contact and lead thermal resistances. SPBs were modeled with 11 W dissipation per board for a 21‑minute active window. Initial results showed multiple EEE components exceeded ECSS derating limits, with a hotspot (U27) at 109.0°C. A targeted mitigation copper heat strap on U27 and SPB relocation toward the base plate was applied. Reanalysis reduced U27 peak temperature to 56.8°C (Δ ≈ 52.2°C) and restored derating margins to meet ECSS criteria. The study demonstrates that localized passive heat path enhancement and layout optimization effectively recover thermal margins for high density spacecraft electronics.