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목차
Preface to the Second Edition xv
Contributors xvii
Acronyms xix
Introduction and Overview of Microelectronic Packaging 1
W. D. Brown
Introduction 1
Functions of an Electronic Package 2
Packaging Hierarchy 3
Die Attach 5
First-Level Interconnection 5
Package Lid and Pin Sealing 7
Second-Level Interconnection 7
Brief History of Microelectronic Packaging Technology 8
Driving Forces on Packaging Technology 19
Manufacturing Costs 20
Manufacturability Costs 20
Size and Weight 20
Electrical Design 21
Thermal Design 21
Mechanical Design 21
Manufacturability 22
Testability 22
Reliability 23
Serviceability 23
Material Selection 23
Summary 24
References 25
Exercises 26
Materials for Microelectronic Packaging 29
W. D. Brown
Richard Ulrich
Introduction 29
Some Important Packaging Material Properties 29
Mechanical Properties 30
Moisture Penetration 30
Interfacial Adhesion 31
Electrical Properties 31
Thermal Properties 33
Chemical Properties 34
System Reliability 34
Ceramics in Packaging 35
Alumina (Al2O3) 37
Beryllia (BeO) 39
Aluminum Nitride (AIN) 40
Silicon Carbide (SiC) 41
Boron Nitride (BN) 41
Glass--Ceramics 42
Polymers in Packaging 43
Fundamentals of Polymers 43
Thermoplastic and Thermosetting Polymers 45
Effects of Water and Solvents on Polymers 46
Some Polymer Properties of Interest 47
Primary Classes of Polymers Used in Microelectronics 50
First-Level Packaging Applications of Polymers 55
Metals in Packaging 57
Die Bonding 57
Chip to Package or Substrate 58
Package Construction 64
Materials Used in High-density Interconnect Substrates 66
Laminate Substrates 67
Ceramic Substrates 70
Deposited Thin-Film Substrates 71
Summary 73
References 73
Exercises 75
Processing Technologies 77
H. A. Naseem
Susan Burkett
Introduction 77
Thin-Film Deposition 77
Vacuum Facts 78
Vacuum Pumps 79
Evaporation 81
Sputtering 84
Chemical Vapor Deposition 88
Plating 89
Patterning 93
Photolithography 93
Etching 96
Metal-to-Metal Joining 98
Solid-State Bonding 98
Soldering and Brazing 101
Summary 102
References 102
Exercises 103
Organic Printed Circuit Board Materials and Processes 105
Richard C. Snogren
Introduction 105
Common Issues for All PCB Layer Constructions 106
Data Formats and Specifications 106
Computer-Aided Manufacturing and Tooling 107
Panelization 108
Laminate Materials 109
Manufacturing Tolerance Overview 111
PCB Process Flow 112
Manufacture of Inner Layers 112
Manufacture of MLB Structure and Outer Layers 118
Electrical Test 124
Visual and Dimensional Inspection 124
Contract Review 125
Microsection Analysis 125
Dielectric Materials 127
Dielectric Material Drivers 127
Dielectric Material Constructions and Process Considerations 128
Surface Finishes 133
Advanced PCB Structures 134
High-density Interconnection (HDI) or Microvia 134
Specifications and Standards 141
The IPC, a Brief History 141
Relevant Standards to Organic Printed Circuit Boards 141
Key Terms 142
References 145
Exercises 145
Ceramic Substrates 149
Aicha A. R. Elshabini
Fred D. Barlow III
Ceramics in Electronic Packaging 149
Introduction and Background 149
Functions of Ceramic Substrates 149
Ceramic Advantages 150
Ceramic Compositions 150
Ceramic Substrate Manufacturing 151
Electrical Properties of Ceramic Substrates 152
Mechanical Properties of Ceramic Substrates 153
Physical Properties of Ceramic Substrates 154
Design Rules 154
Thin Film on Ceramics 155
Introduction and Background 155
Deposition Techniques 155
Thin-Film Substrate Properties 156
Thick Films on Ceramics 156
Introduction and Background 156
Screen Preparation and Inspection 157
Screen-Printing Process 158
Substrate Cleaning and Process Environment 159
Thick-Film Formulations 159
Heat Treatment Processes for Pastes 160
Thick-Film Metallizations 161
Thick-Film Dielectrics 162
Thick-Film Resistors 162
Low-Temperature Cofired Ceramics (LTCC) 163
LTCC Technology 163
Tape Handling and Cleanroom Environment 166
Via Formation 167
Via Fill 169
Screen-Printing Considerations for Tape Materials 171
Inspection 172
Tape Layer Collation 172
Lamination 173
Firing 175
Postprocessing 177
Design Considerations 178
Shrinkage Prediction and Control 179
HTCC Fabrication Process 180
HTCC Process 180
Multilayer ALN 180
High-Current Substrates 180
Direct Bonded Copper Process 181
Active Metal Brazing (AMB) 182
Summary 182
References 183
Exercises 184
Electrical Considerations, Modeling, and Simulation 187
S. S. Ang
L. W. Schaper
Introduction 187
When Is a Wire Not a Wire? 187
Packaging Electrical Functions 187
Fundamental Considerations 188
Resistance 189
Self and Mutual Inductance 194
Capacitance 200
Parameter Extraction Programs 202
Signal Integrity and Modeling 202
Digital Signal Representation and Spectrum 203
Driver and Receiver Models 205
RC Delay 207
Transmission Lines 212
Microstrip Transmission Lines 215
Termination Reflections 217
Signal Line Losses and Skin Effect 223
Net Topology 224
Coupled Noise or Crosstalk 226
Power and Ground 230
Dynamic Power Distribution 231
Power System Impedance 231
Resonance of Decoupling Capacitance 232
Power Distribution Modeling 232
Switching Noise 233
Overall Packaged IC Models and Simulation 236
Simulation 237
Time-Domain Reflectometry 238
Summary 242
References 242
Exercises 243
Thermal Considerations 247
Rick J. Couvillion
Introduction 247
Heat Sources 247
Approaches to Heat Removal 249
Failure Modes 250
Heat Transfer Fundamentals 251
Heat Transfer Rate Equations 251
Transient Thermal Response of Components 255
Conduction in Various Shapes 257
Overall Resistance 264
Forced Convection Heat Transfer 268
Natural or Free Convection Heat Transfer 276
Air Cooling 282
Liquid Cooling 282
Single-Phase Liquid Cooling 282
Two-Phase Liquid Cooling 282
Advanced Cooling Methods 286
Heat Pipes 286
Thermoelectric Cooling 287
Microchannel Cooling 288
Computer-Aided Modeling 289
Solids Modeling 289
Computational Fluid Dynamics 290
Levels of Decoupling 290
Typical Results 290
Summary 290
References 292
Appendix: Thermophysical Properties for Heat Transfer Calculations 292
Exercises 297
Mechanical Design Considerations 299
William F. Schmidt
Introduction 299
Deformation and Strain 299
Stress 303
Constitutive Relations 307
Elastic Material 307
Plastic Material 309
Creep 310
Simplified Forms 311
Plane Stress and Plane Strain 311
Beams 312
Failure Theories 317
Static Failure 318
Fracture Mechanics 320
Fatigue 321
Analytical Determination of Stress 323
Bi-Material Assembly--Axial Effects 323
Bi-Material Assembly--Bending Effects 328
Peeling Stress 329
Tri-Material Assembly 331
Numerical Formulations 335
Finite-Element Method 335
Commercial Codes 338
Limitations and Hazards 340
Summary 341
References 341
Bibliography 341
Exercises 342
Discrete and Embedded Passive Devices 349
Richard Ulrich
Introduction 349
Passives in Modern Electronic Systems 350
Definitions and Configurations of Passives 354
Film-Based Passives 356
Resistors 358
Design Equations 358
Sizing Embedded Resistors 360
Materials for Resistors 361
Capacitors 363
Paraelectrics and Ferroelectrics 365
Sizing Dielectric Areas 367
Dielectric Materials Used in Capacitors 369
Inductors 371
Electrical Characteristics of Passives 372
Modeling Ideal Passives 373
Modeling Real Capacitors 374
Differences in Parasitics Between Discrete and Embedded Capacitors 375
Modeling Real Inductors 377
Modeling Real Resistors 379
Issues in Embedding Passives 379
Reasons for Embedding Passives 379
Problems with Embedding Passive Devices 380
Decoupling Capacitors 381
Decoupling Issues 381
Decoupling with Discrete Capacitors 382
Decoupling with Embedded Capacitors 383
Future of Passives 384
References 385
Exercises 386
Electronic Package Assembly 389
Tarak A. Railkar
Robert W. Warren
Introduction 389
Facilities 389
Cleanroom Requirements 389
Electrostatic Discharge Requirements 391
Moisture Sensitivity Level (MSL) Requirements 392
Reflow Temperatures 393
Component Handling 393
Shipping 393
Storage 393
Handling/Processing 394
Surface-Mount Technology (SMT) Assembly 395
Solder Printing and Related Defects 395
Component Placement 397
Solder Reflow 398
Cleaning 399
Wafer Preparation 399
Wafer Probing 399
Wafer Mounting 401
Wafer Backgrinding/Thinning 401
Wafer Sawing 402
Wafer Scribing 403
Equipment 404
Die Attachment 405
Epoxy 405
Thermoplastics and Thermosets 406
Solder 407
Rework 407
Die-Attach Equipment 408
Wirebonding 409
Thermocompression Wirebonding 409
Ultrasonic Wirebonding 409
Thermosonic Wirebonding 410
Ribbon Bonding 410
Ball Bonding 410
Wedge Bonding 411
Wirebond Testing 411
Tape-Automated Bonding 414
Plasma Surface Treatment 415
Flip-Chip 417
Wafer Bumping 419
Fluxing 422
Package Sealing/Encapsulation/Coating 425
Hermetic Package Sealing 426
Hermetic Package Testing 426
Nonhermetic Encapsulation 427
Package-Level Processes 429
Lead Trim, Form, and Singulation 430
Solder Ball Attach and Singulation 430
Marking 430
State-of-the-Art Technologies 430
3D and Stacked Die 430
Radio Frequency (RF) Modules 431
Microelectromechanical Systems (MEMS) and Microoptoelectromechanical Systems (MOEMS) 432
Nanotechnology 434
Summary 435
References 435
Exercises 436
Design Considerations 437
J. P. Parkerson
L. W. Schaper
Introduction 437
Packaging and the Electronic System 437
Packaging Functions 437
System and Packaging Metrics 438
System Constraints and Trade-Offs 440
System Partitioning 442
Trade-Offs Among Packaging Functions 445
Signal Wiring 445
Power Distribution 452
Thermal Management 455
Interconnect Testing 456
Trade-Off Design Example 458
Product Development Cycle 460
Traditional and Modified Product Cycles 461
Market Analysis and Product Specification 463
Block Diagram and Partitioning 464
Technology Selection 464
ASIC/PCB/MCM Design 465
Thermal/Mechanical Design 466
Test Program Development 466
Manufacturing Tooling 467
Fabrication/Assembly 467
Characterization 467
Qualification 467
Product Introduction 468
Design Concepts 468
Component Overview 469
Schematic Overview 471
Design Viewpoint 474
Back Annotation 475
Simulation and Evaluation 476
PCB/MCM Board Design Process 477
PCB Design Flow 477
Librarian 477
Package 479
Layout 479
Fablink 481
Summary of Design Concepts 484
Summary 484
References 484
Bibliography 485
Exercises 485
Radio Frequency and Microwave Packaging 487
Fred Barlow
Aicha Elshabini
Introduction and Background 487
Nature of High-Frequency Circuits 487
Applications of High-Frequency Circuits 488
Basic Concepts 490
Transmission Lines 494
Transmission Line Modes 495
System-Level Transmission Lines 496
Planar Transmission Lines 499
Discontinuities 505
High-Frequency Circuit Implementation 510
Material Considerations 510
Microwave Monolithic Integrated Circuits 513
MIC Technologies 513
Lumped-Element Components 515
Capacitors 515
Inductors 516
Resistors and Terminations 518
Distributed Components 518
Impedance-Matching Devices 518
Filters 519
Power Dividers 520
Couplers 522
Simulation and Circuit Layout 523
Measurement and Testing 525
Frequency-Domain Measurements 525
Measurement Systems 525
Probing Hardware and Connectors 526
Time-Domain Measurements 527
Design Example 528
Summary 531
References 531
Exercises 535
Power Electronics Packaging 537
Alexander B. Lostetter
Kraig Olejniczak
Introduction 537
Semiconductor Power Device Technology 537
Ideal and Nonideal Power Switching 538
Power Diodes 540
Thyristors 541
Power Bipolar Junction Transistors 542
Power MOSFETs 542
Insulated Gate Bipolar Transistors 542
Static Induction Transistors (SITs) 543
Silicon Carbide Semiconductor Devices 543
Commercially Available Power Packages 547
Discrete Power Device Packages 547
Multichip Power Modules (MCPMs) and Completely Integrated Solutions 548
Thermal Performance of Commercial Packages [53--58] 552
Power Packaging Design Methodology 561
Overall System Design Philosophies 561
Substrate Selection 563
Baseplate and Heat Spreader Selection 565
Die-Attach Methods [62--64] 565
Wirebonding [65] 570
Thermal Design 573
Electromagnetic Interference (EMI) and Electromagnetic Compliance (EMC) 576
High-Temperature Power Electronics 576
Summary 577
References 577
Exercises 579
Multichip and Three-Dimensional Packaging 583
James Lyke
Introduction 583
Brief History of Multichip Packaging 583
Motivations for Multichip Packaging 585
Packaging Hierarchy and Taxonomy 588
Hierarchy 588
Anatomy of an MCM 588
Planar MCM Approaches 591
Three-Dimensional Systems 599
Defining Characteristics of 3D Systems 599
Die and Package Stacks 602
MCM Stacks 605
Folding Approaches 607
Options in Multichip Packaging 608
Yield/Known Good Die 608
Process Compatibility 609
Density Metrics in 2D and 3D Packaging 609
Wiring Density 609
Input/Output 610
Electrical Performance and Substrate Selection 613
Thermal Management 613
Testability 615
System in a Package Versus System on a Chip 615
Emerging Trends in Density Scaling 615
Method 1: For Regular and/or Low-Pincount Assemblies 617
Method 2: For Moderately Complex Pincount Assemblies 618
Method 3: For Moderately Complex Pincount Assemblies 619
Issues in Ultradense Packaging 619
Summary 621
References 622
Exercises 623
Packaging of MEMS and MOEMS: Challenges and a Case Study 625
Ajay P. Malshe
Volkan Ozguz
John Patrick O'Connor
Introduction 625
Background 625
Mixed Signals, Mixed Domains, and Mixed Scales Packaging: Toward the Next-Generation Application-Specific Integrated Systems 626
Microelectromechanical Systems 626
Challenges in Mems Integration 628
Release and Stiction 630
Dicing 631
Die Handling 631
Wafer-Level Encapsulation 631
Stress 632
Outgassing 632
Testing 633
State-of-the-Art in MEMS Packaging 633
Future Directions 635
Packaging Considerations and Guidelines Related to the Digital Micromirror Device 636
Introduction and Background to MOEMS and Particularly DMD Devices 636
Parameters Influencing DMD Packaging 637
DMD Package Design 640
DMD Hermetic Package Assembly 646
Future Packaging Challenges 647
References 648
Exercises 650
Reliability Considerations 651
Richard Ulrich
Introduction 651
Definitions 651
Patterns of Failure 653
Coverage in This Chapter 654
Failure Mechanisms 655
Corrosion 656
Mechanical Stress 659
Electrical Stress 660
Techniques for Failure Analysis 660
Accelerated Testing 661
Accelerated Environmental Testing 663
Electrostatic Discharge Accelerated Testing 666
Other Accelerated Tests 666
Test Structures 667
Reliability Metrology 668
Failure Rate, MTBF, and FITs 668
Reliability Functions 668
Weibull Distribution 674
Normal Distribution 677
Failure Distributions and the Bathtub Curve 680
Failure Statistics for Microelectronic Systems 681
Predicting Failure in Components That Have Multiple Failure Modes 683
Industrial Practice of Reliability Science for Microelectronics 684
Bibliography 684
Exercises 684
Cost Evaluation and Analysis 691
Terry R. Collins
Scott J. Mason
Heather Nachtmann
Introduction 691
Product Cost 691
Direct Costs 692
Indirect Costs 692
Traditional Volume-Based Costing 692
Activity-Based Costing 694
Break-even Analysis 696
Linear Break-even Analysis 696
Piecewise Linear Break-even Analysis 698
Learning Curve Relationships 698
Determining Exponent Values for Improvement Rates 700
Learning Curve Examples 702
Forecasting Models 703
Mean-Squared Error (MSE) 704
Mean Absolute Deviation (MAD) 704
Mean Percentage Error (MPE) 704
Mean Absolute Percentage Error (MAPE) 705
Moving Average 705
Forecasting Sales Based on Historical Data 706
Exponential Smoothing 707
Least-Squares Regression 712
Comparative Analysis 714
Capital Project Selection and Evaluation 715
Replacement Analysis 716
Sensitivity Analysis 717
Single-Parameter Sensitivity Analysis 718
Optimistic--Pessimistic Sensitivity Analysis 719
Summary 720
References 721
Exercises 721
Analytical Techniques for Materials Characterization 725
Emily A. Clark
Ingrid Fritsch
Seifollah Nasrazadani
Charles S. Henry
Overview 725
X-Ray Diffraction 725
Summary 728
Basic Principles 728
Instrumentation 729
Practical Considerations and Applications 731
Raman Spectroscopy 734
Summary 734
Basic Principles 735
Instrumentation 735
Practical Considerations and Applications 736
Scanning Probe Microscopy 740
Summary 740
STM Principles and Instrumentation 740
SFM Principles and Instrumentation 741
Practical Considerations and Applications 742
Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy 744
Summary 744
Basic Principles 745
Instrumentation 746
Practical Considerations and Applications 748
Confocal Microscopy 750
Summary 750
Basic Principles 750
Instrumentation 750
Practical Considerations and Applications 751
Auger Electron Spectroscopy 752
Summary 752
Basic Principles 753
Instrumentation 757
Practical Considerations and Applications 759
X-ray Photoelectron Spectroscopy 766
Summary 766
Basic Principles 766
Instrumentation 769
Practical Considerations and Applications 770
Secondary Ion Mass Spectrometry 775
Summary 775
Basic Principles 776
Instrumentation 778
Practical Considerations and Applications 782
References 786
Exercises 790
Index 793
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New feature
Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:
All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.
Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.
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