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Preface to the Second Edition xv

Contributors xvii

Acronyms xix

Introduction and Overview of Microelectronic Packaging 1

W. D. Brown

Introduction 1

Functions of an Electronic Package 2

Packaging Hierarchy 3

Die Attach 5

First-Level Interconnection 5

Package Lid and Pin Sealing 7

Second-Level Interconnection 7

Brief History of Microelectronic Packaging Technology 8

Driving Forces on Packaging Technology 19

Manufacturing Costs 20

Manufacturability Costs 20

Size and Weight 20

Electrical Design 21

Thermal Design 21

Mechanical Design 21

Manufacturability 22

Testability 22

Reliability 23

Serviceability 23

Material Selection 23

Summary 24

References 25

Exercises 26

Materials for Microelectronic Packaging 29

W. D. Brown

Richard Ulrich

Introduction 29

Some Important Packaging Material Properties 29

Mechanical Properties 30

Moisture Penetration 30

Interfacial Adhesion 31

Electrical Properties 31

Thermal Properties 33

Chemical Properties 34

System Reliability 34

Ceramics in Packaging 35

Alumina (Al2O3) 37

Beryllia (BeO) 39

Aluminum Nitride (AIN) 40

Silicon Carbide (SiC) 41

Boron Nitride (BN) 41

Glass--Ceramics 42

Polymers in Packaging 43

Fundamentals of Polymers 43

Thermoplastic and Thermosetting Polymers 45

Effects of Water and Solvents on Polymers 46

Some Polymer Properties of Interest 47

Primary Classes of Polymers Used in Microelectronics 50

First-Level Packaging Applications of Polymers 55

Metals in Packaging 57

Die Bonding 57

Chip to Package or Substrate 58

Package Construction 64

Materials Used in High-density Interconnect Substrates 66

Laminate Substrates 67

Ceramic Substrates 70

Deposited Thin-Film Substrates 71

Summary 73

References 73

Exercises 75

Processing Technologies 77

H. A. Naseem

Susan Burkett

Introduction 77

Thin-Film Deposition 77

Vacuum Facts 78

Vacuum Pumps 79

Evaporation 81

Sputtering 84

Chemical Vapor Deposition 88

Plating 89

Patterning 93

Photolithography 93

Etching 96

Metal-to-Metal Joining 98

Solid-State Bonding 98

Soldering and Brazing 101

Summary 102

References 102

Exercises 103

Organic Printed Circuit Board Materials and Processes 105

Richard C. Snogren

Introduction 105

Common Issues for All PCB Layer Constructions 106

Data Formats and Specifications 106

Computer-Aided Manufacturing and Tooling 107

Panelization 108

Laminate Materials 109

Manufacturing Tolerance Overview 111

PCB Process Flow 112

Manufacture of Inner Layers 112

Manufacture of MLB Structure and Outer Layers 118

Electrical Test 124

Visual and Dimensional Inspection 124

Contract Review 125

Microsection Analysis 125

Dielectric Materials 127

Dielectric Material Drivers 127

Dielectric Material Constructions and Process Considerations 128

Surface Finishes 133

Advanced PCB Structures 134

High-density Interconnection (HDI) or Microvia 134

Specifications and Standards 141

The IPC, a Brief History 141

Relevant Standards to Organic Printed Circuit Boards 141

Key Terms 142

References 145

Exercises 145

Ceramic Substrates 149

Aicha A. R. Elshabini

Fred D. Barlow III

Ceramics in Electronic Packaging 149

Introduction and Background 149

Functions of Ceramic Substrates 149

Ceramic Advantages 150

Ceramic Compositions 150

Ceramic Substrate Manufacturing 151

Electrical Properties of Ceramic Substrates 152

Mechanical Properties of Ceramic Substrates 153

Physical Properties of Ceramic Substrates 154

Design Rules 154

Thin Film on Ceramics 155

Introduction and Background 155

Deposition Techniques 155

Thin-Film Substrate Properties 156

Thick Films on Ceramics 156

Introduction and Background 156

Screen Preparation and Inspection 157

Screen-Printing Process 158

Substrate Cleaning and Process Environment 159

Thick-Film Formulations 159

Heat Treatment Processes for Pastes 160

Thick-Film Metallizations 161

Thick-Film Dielectrics 162

Thick-Film Resistors 162

Low-Temperature Cofired Ceramics (LTCC) 163

LTCC Technology 163

Tape Handling and Cleanroom Environment 166

Via Formation 167

Via Fill 169

Screen-Printing Considerations for Tape Materials 171

Inspection 172

Tape Layer Collation 172

Lamination 173

Firing 175

Postprocessing 177

Design Considerations 178

Shrinkage Prediction and Control 179

HTCC Fabrication Process 180

HTCC Process 180

Multilayer ALN 180

High-Current Substrates 180

Direct Bonded Copper Process 181

Active Metal Brazing (AMB) 182

Summary 182

References 183

Exercises 184

Electrical Considerations, Modeling, and Simulation 187

S. S. Ang

L. W. Schaper

Introduction 187

When Is a Wire Not a Wire? 187

Packaging Electrical Functions 187

Fundamental Considerations 188

Resistance 189

Self and Mutual Inductance 194

Capacitance 200

Parameter Extraction Programs 202

Signal Integrity and Modeling 202

Digital Signal Representation and Spectrum 203

Driver and Receiver Models 205

RC Delay 207

Transmission Lines 212

Microstrip Transmission Lines 215

Termination Reflections 217

Signal Line Losses and Skin Effect 223

Net Topology 224

Coupled Noise or Crosstalk 226

Power and Ground 230

Dynamic Power Distribution 231

Power System Impedance 231

Resonance of Decoupling Capacitance 232

Power Distribution Modeling 232

Switching Noise 233

Overall Packaged IC Models and Simulation 236

Simulation 237

Time-Domain Reflectometry 238

Summary 242

References 242

Exercises 243

Thermal Considerations 247

Rick J. Couvillion

Introduction 247

Heat Sources 247

Approaches to Heat Removal 249

Failure Modes 250

Heat Transfer Fundamentals 251

Heat Transfer Rate Equations 251

Transient Thermal Response of Components 255

Conduction in Various Shapes 257

Overall Resistance 264

Forced Convection Heat Transfer 268

Natural or Free Convection Heat Transfer 276

Air Cooling 282

Liquid Cooling 282

Single-Phase Liquid Cooling 282

Two-Phase Liquid Cooling 282

Advanced Cooling Methods 286

Heat Pipes 286

Thermoelectric Cooling 287

Microchannel Cooling 288

Computer-Aided Modeling 289

Solids Modeling 289

Computational Fluid Dynamics 290

Levels of Decoupling 290

Typical Results 290

Summary 290

References 292

Appendix: Thermophysical Properties for Heat Transfer Calculations 292

Exercises 297

Mechanical Design Considerations 299

William F. Schmidt

Introduction 299

Deformation and Strain 299

Stress 303

Constitutive Relations 307

Elastic Material 307

Plastic Material 309

Creep 310

Simplified Forms 311

Plane Stress and Plane Strain 311

Beams 312

Failure Theories 317

Static Failure 318

Fracture Mechanics 320

Fatigue 321

Analytical Determination of Stress 323

Bi-Material Assembly--Axial Effects 323

Bi-Material Assembly--Bending Effects 328

Peeling Stress 329

Tri-Material Assembly 331

Numerical Formulations 335

Finite-Element Method 335

Commercial Codes 338

Limitations and Hazards 340

Summary 341

References 341

Bibliography 341

Exercises 342

Discrete and Embedded Passive Devices 349

Richard Ulrich

Introduction 349

Passives in Modern Electronic Systems 350

Definitions and Configurations of Passives 354

Film-Based Passives 356

Resistors 358

Design Equations 358

Sizing Embedded Resistors 360

Materials for Resistors 361

Capacitors 363

Paraelectrics and Ferroelectrics 365

Sizing Dielectric Areas 367

Dielectric Materials Used in Capacitors 369

Inductors 371

Electrical Characteristics of Passives 372

Modeling Ideal Passives 373

Modeling Real Capacitors 374

Differences in Parasitics Between Discrete and Embedded Capacitors 375

Modeling Real Inductors 377

Modeling Real Resistors 379

Issues in Embedding Passives 379

Reasons for Embedding Passives 379

Problems with Embedding Passive Devices 380

Decoupling Capacitors 381

Decoupling Issues 381

Decoupling with Discrete Capacitors 382

Decoupling with Embedded Capacitors 383

Future of Passives 384

References 385

Exercises 386

Electronic Package Assembly 389

Tarak A. Railkar

Robert W. Warren

Introduction 389

Facilities 389

Cleanroom Requirements 389

Electrostatic Discharge Requirements 391

Moisture Sensitivity Level (MSL) Requirements 392

Reflow Temperatures 393

Component Handling 393

Shipping 393

Storage 393

Handling/Processing 394

Surface-Mount Technology (SMT) Assembly 395

Solder Printing and Related Defects 395

Component Placement 397

Solder Reflow 398

Cleaning 399

Wafer Preparation 399

Wafer Probing 399

Wafer Mounting 401

Wafer Backgrinding/Thinning 401

Wafer Sawing 402

Wafer Scribing 403

Equipment 404

Die Attachment 405

Epoxy 405

Thermoplastics and Thermosets 406

Solder 407

Rework 407

Die-Attach Equipment 408

Wirebonding 409

Thermocompression Wirebonding 409

Ultrasonic Wirebonding 409

Thermosonic Wirebonding 410

Ribbon Bonding 410

Ball Bonding 410

Wedge Bonding 411

Wirebond Testing 411

Tape-Automated Bonding 414

Plasma Surface Treatment 415

Flip-Chip 417

Wafer Bumping 419

Fluxing 422

Package Sealing/Encapsulation/Coating 425

Hermetic Package Sealing 426

Hermetic Package Testing 426

Nonhermetic Encapsulation 427

Package-Level Processes 429

Lead Trim, Form, and Singulation 430

Solder Ball Attach and Singulation 430

Marking 430

State-of-the-Art Technologies 430

3D and Stacked Die 430

Radio Frequency (RF) Modules 431

Microelectromechanical Systems (MEMS) and Microoptoelectromechanical Systems (MOEMS) 432

Nanotechnology 434

Summary 435

References 435

Exercises 436

Design Considerations 437

J. P. Parkerson

L. W. Schaper

Introduction 437

Packaging and the Electronic System 437

Packaging Functions 437

System and Packaging Metrics 438

System Constraints and Trade-Offs 440

System Partitioning 442

Trade-Offs Among Packaging Functions 445

Signal Wiring 445

Power Distribution 452

Thermal Management 455

Interconnect Testing 456

Trade-Off Design Example 458

Product Development Cycle 460

Traditional and Modified Product Cycles 461

Market Analysis and Product Specification 463

Block Diagram and Partitioning 464

Technology Selection 464

ASIC/PCB/MCM Design 465

Thermal/Mechanical Design 466

Test Program Development 466

Manufacturing Tooling 467

Fabrication/Assembly 467

Characterization 467

Qualification 467

Product Introduction 468

Design Concepts 468

Component Overview 469

Schematic Overview 471

Design Viewpoint 474

Back Annotation 475

Simulation and Evaluation 476

PCB/MCM Board Design Process 477

PCB Design Flow 477

Librarian 477

Package 479

Layout 479

Fablink 481

Summary of Design Concepts 484

Summary 484

References 484

Bibliography 485

Exercises 485

Radio Frequency and Microwave Packaging 487

Fred Barlow

Aicha Elshabini

Introduction and Background 487

Nature of High-Frequency Circuits 487

Applications of High-Frequency Circuits 488

Basic Concepts 490

Transmission Lines 494

Transmission Line Modes 495

System-Level Transmission Lines 496

Planar Transmission Lines 499

Discontinuities 505

High-Frequency Circuit Implementation 510

Material Considerations 510

Microwave Monolithic Integrated Circuits 513

MIC Technologies 513

Lumped-Element Components 515

Capacitors 515

Inductors 516

Resistors and Terminations 518

Distributed Components 518

Impedance-Matching Devices 518

Filters 519

Power Dividers 520

Couplers 522

Simulation and Circuit Layout 523

Measurement and Testing 525

Frequency-Domain Measurements 525

Measurement Systems 525

Probing Hardware and Connectors 526

Time-Domain Measurements 527

Design Example 528

Summary 531

References 531

Exercises 535

Power Electronics Packaging 537

Alexander B. Lostetter

Kraig Olejniczak

Introduction 537

Semiconductor Power Device Technology 537

Ideal and Nonideal Power Switching 538

Power Diodes 540

Thyristors 541

Power Bipolar Junction Transistors 542

Power MOSFETs 542

Insulated Gate Bipolar Transistors 542

Static Induction Transistors (SITs) 543

Silicon Carbide Semiconductor Devices 543

Commercially Available Power Packages 547

Discrete Power Device Packages 547

Multichip Power Modules (MCPMs) and Completely Integrated Solutions 548

Thermal Performance of Commercial Packages [53--58] 552

Power Packaging Design Methodology 561

Overall System Design Philosophies 561

Substrate Selection 563

Baseplate and Heat Spreader Selection 565

Die-Attach Methods [62--64] 565

Wirebonding [65] 570

Thermal Design 573

Electromagnetic Interference (EMI) and Electromagnetic Compliance (EMC) 576

High-Temperature Power Electronics 576

Summary 577

References 577

Exercises 579

Multichip and Three-Dimensional Packaging 583

James Lyke

Introduction 583

Brief History of Multichip Packaging 583

Motivations for Multichip Packaging 585

Packaging Hierarchy and Taxonomy 588

Hierarchy 588

Anatomy of an MCM 588

Planar MCM Approaches 591

Three-Dimensional Systems 599

Defining Characteristics of 3D Systems 599

Die and Package Stacks 602

MCM Stacks 605

Folding Approaches 607

Options in Multichip Packaging 608

Yield/Known Good Die 608

Process Compatibility 609

Density Metrics in 2D and 3D Packaging 609

Wiring Density 609

Input/Output 610

Electrical Performance and Substrate Selection 613

Thermal Management 613

Testability 615

System in a Package Versus System on a Chip 615

Emerging Trends in Density Scaling 615

Method 1: For Regular and/or Low-Pincount Assemblies 617

Method 2: For Moderately Complex Pincount Assemblies 618

Method 3: For Moderately Complex Pincount Assemblies 619

Issues in Ultradense Packaging 619

Summary 621

References 622

Exercises 623

Packaging of MEMS and MOEMS: Challenges and a Case Study 625

Ajay P. Malshe

Volkan Ozguz

John Patrick O'Connor

Introduction 625

Background 625

Mixed Signals, Mixed Domains, and Mixed Scales Packaging: Toward the Next-Generation Application-Specific Integrated Systems 626

Microelectromechanical Systems 626

Challenges in Mems Integration 628

Release and Stiction 630

Dicing 631

Die Handling 631

Wafer-Level Encapsulation 631

Stress 632

Outgassing 632

Testing 633

State-of-the-Art in MEMS Packaging 633

Future Directions 635

Packaging Considerations and Guidelines Related to the Digital Micromirror Device 636

Introduction and Background to MOEMS and Particularly DMD Devices 636

Parameters Influencing DMD Packaging 637

DMD Package Design 640

DMD Hermetic Package Assembly 646

Future Packaging Challenges 647

References 648

Exercises 650

Reliability Considerations 651

Richard Ulrich

Introduction 651

Definitions 651

Patterns of Failure 653

Coverage in This Chapter 654

Failure Mechanisms 655

Corrosion 656

Mechanical Stress 659

Electrical Stress 660

Techniques for Failure Analysis 660

Accelerated Testing 661

Accelerated Environmental Testing 663

Electrostatic Discharge Accelerated Testing 666

Other Accelerated Tests 666

Test Structures 667

Reliability Metrology 668

Failure Rate, MTBF, and FITs 668

Reliability Functions 668

Weibull Distribution 674

Normal Distribution 677

Failure Distributions and the Bathtub Curve 680

Failure Statistics for Microelectronic Systems 681

Predicting Failure in Components That Have Multiple Failure Modes 683

Industrial Practice of Reliability Science for Microelectronics 684

Bibliography 684

Exercises 684

Cost Evaluation and Analysis 691

Terry R. Collins

Scott J. Mason

Heather Nachtmann

Introduction 691

Product Cost 691

Direct Costs 692

Indirect Costs 692

Traditional Volume-Based Costing 692

Activity-Based Costing 694

Break-even Analysis 696

Linear Break-even Analysis 696

Piecewise Linear Break-even Analysis 698

Learning Curve Relationships 698

Determining Exponent Values for Improvement Rates 700

Learning Curve Examples 702

Forecasting Models 703

Mean-Squared Error (MSE) 704

Mean Absolute Deviation (MAD) 704

Mean Percentage Error (MPE) 704

Mean Absolute Percentage Error (MAPE) 705

Moving Average 705

Forecasting Sales Based on Historical Data 706

Exponential Smoothing 707

Least-Squares Regression 712

Comparative Analysis 714

Capital Project Selection and Evaluation 715

Replacement Analysis 716

Sensitivity Analysis 717

Single-Parameter Sensitivity Analysis 718

Optimistic--Pessimistic Sensitivity Analysis 719

Summary 720

References 721

Exercises 721

Analytical Techniques for Materials Characterization 725

Emily A. Clark

Ingrid Fritsch

Seifollah Nasrazadani

Charles S. Henry

Overview 725

X-Ray Diffraction 725

Summary 728

Basic Principles 728

Instrumentation 729

Practical Considerations and Applications 731

Raman Spectroscopy 734

Summary 734

Basic Principles 735

Instrumentation 735

Practical Considerations and Applications 736

Scanning Probe Microscopy 740

Summary 740

STM Principles and Instrumentation 740

SFM Principles and Instrumentation 741

Practical Considerations and Applications 742

Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy 744

Summary 744

Basic Principles 745

Instrumentation 746

Practical Considerations and Applications 748

Confocal Microscopy 750

Summary 750

Basic Principles 750

Instrumentation 750

Practical Considerations and Applications 751

Auger Electron Spectroscopy 752

Summary 752

Basic Principles 753

Instrumentation 757

Practical Considerations and Applications 759

X-ray Photoelectron Spectroscopy 766

Summary 766

Basic Principles 766

Instrumentation 769

Practical Considerations and Applications 770

Secondary Ion Mass Spectrometry 775

Summary 775

Basic Principles 776

Instrumentation 778

Practical Considerations and Applications 782

References 786

Exercises 790

Index 793

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알라딘제공
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

New feature

Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.

Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:

  • Packaging materials and applications
  • Modeling and simulations
  • Analytical techniques for materials
  • MEMS packaging
  • Fabrication technologies and package design
  • Reliability
  • Electrical, mechanical, and thermal considerations
  • Three-dimensional packaging

All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.

Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.



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