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표제지 1

목차 4

Ⅰ. 서론 10

1. 연구 배경 10

2. 단분산 고분자 입자 12

3. 이방성 도전성 필름 (Anisotropic Conductive Film) 16

4. 연구목적 19

Ⅱ. 실험 20

1. 시약 및 재료 20

2. 폴리스티렌 단분산 입자 제조 20

2-1. 분산중합 20

2-2. 씨드 팽윤 중합 22

3. 무전해 도금 28

3-1. 폴리스티렌 입자의 전처리 28

3-2. 무전해 니켈 도금 30

4. 분석 34

4-1. 형태구조 분석 34

4-2. 분자량 측정 34

4-3. X-선 회절 분석 34

4-4. 도금층 형상, 두께 분석 및 구성원소 측정 34

4-5. 열적 물성 측정 35

Ⅲ. 결과 및 고찰 36

1. 단분산 폴리스티렌 제조 36

1-1. 분산중합시 분산매질의 영향 36

1-2. 제조된 입자의 분자량 측정 40

1-3. 제조된 입자의 열적 물성 41

2. 씨드 팽윤 중합을 이용한 팽윤 입자 제조 42

2-1. 활성화 씨드 팽윤 중합 42

2-2. 활성화 씨드 팽윤 중합에 의한 팽윤 입자의 열분석 45

2-3. 씨드 팽윤 중합 47

3. 무전해 니켈 도금 50

3-1. 전처리시 PdCl₂ 농도의 영향 50

3-2. 무전해 도금시 착화제 glycine 농도의 영향 54

3-3. 무전해 도금시 도금액의 투여 시간의 영향 56

3-4. 니켈 도금층의 결정 구조 58

3-5. 니켈 도금 복합입자의 열적물성 측정 61

Ⅳ. 결론 63

Ⅴ. 참고문헌 65

ABSTRACT 69

표목차 9

Table 1. Various Materials of ACF 18

Table 2. Standard Formulation for the Preparation of Monodisperse... 21

Table 3. Standard Formulation for the Preparation of Monodisperse... 23

Table 4. Standard Formulation for the Preparation of Swollen Seed... 25

Table 5. Standard Formulation for the Preparation of Swollen Seed... 27

Table 6. Bath and Dropping Solution Composition for Electroless Nickel... 31

Table 7. Hildebrand Parameters of Solvents at 25 ℃ 38

Table 8. Effect of PdCl₂ and SnCl₂ Concentration 51

Table 9. EDX Analysis of the Metallic Layer Mounted on Carbon Tape 60

그림목차 6

Figure 1. Schematic representation of particle growth in dispersion... 15

Figure 2. Schematic diagram of TCP/LCD assembly and conductive... 17

Figure 3. Pre-treatment procedure of polystyrene seed particles for... 29

Figure 4. Schematic representation of electroless Ni plating process 29

Figure 5. Structure of dodecyltrimethyl ammonium bromide 32

Figure 6. Structure of lead(Ⅱ) nitrate (a) and nickel(Ⅱ) sulfate (b) 32

Figure 7. Structure of glycine (a) and sodium hypophosphite (b) 32

Figure 8. Controlled profile of pH value during the stage of electroless... 33

Figure 9. Scanning electron microscopy (SEM) and optical microscopy... 39

Figure 10. Molecular weight distribution of a polystyrene in a mixture... 40

Figure 11. Differential scanning calorimeter (DSC) thermogram of the... 41

Figure 12. SEM and OM photographs of swollen seeded polystyrene... 43

Figure 13. SEM and OM photographs of swollen seeded particles by... 44

Figure 14. Thermogravimetric analysis (TGA) graph of PS/St swollen... 46

Figure 15. SEM and OM photographs of swollen polystyrene particles... 48

Figure 16. OM photographs of swollen polystyrene particles by seed... 49

Figure 17. SEM micrographs of nickel-coated polystyrene particles... 52

Figure 18. Ni shell extracted from sample Figure 17(d) 53

Figure 19. SEM micrographs of nickel-coated polystyrene particles... 55

Figure 20. SEM micrographs of nickel-coated polystyrene particles... 57

Figure 21. XRD patterns for polystyrene seed particles (sample (a) of... 59

Figure 22. TGA graph of Ni coating seed and PS seed 62

초록보기

 In this study, we synthesized monodisperse polystyrene particles by dispersion polymerization, larger swollen polystyrene particles by seed swelling polymerization, and polymer core/metal shell composite particles by the electroless nickel plating onto polystyrene particles. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling dispersion medium and water content. It is speculated that the critical molecular weight increases as the polarity of dispersion medium decreases and the growing oligomers slowly precipitate, resulting in fewer number of nuclei and eventually larger size of particles. With DVB as a swelling monomer in the activated seed swelling polymerization, the crosslinked swollen particles could be produced and their thermal resistance was substantial.

We investigated morphology and crystal structures of nickel layer of polystyrene/nickel composite particles to see the effect of plating conditions, such as PdCl₂ and glycine concentration and the dropping rate of nickel plating solution, on nickel deposition. With PdCl₂ and glycine concentration at more than 0.4 g/1 and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was employed by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min shows a relatively uniform plating. The crystallographic structure of the nickel layer, as confirmed by XRD and EDX, was found to be amorphous.

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